aircannonsinc Chapter 904
Chapter 904
After a moment of hesitation, almost all semiconductor-related institutions in many countries, under the guidance of the country's top leaders, went to the United States to conduct some trade exchanges and cooperation.
In order to bring themselves closer to the United States.
After all, the United States can indeed be at the forefront of the world in the development of the semiconductor industry for a long time in the future with its three-dimensional stacked chips.
After all, almost all experts in the semiconductor industry know what kind of existence these three stacked chips are in the semiconductor industry.
Three-dimensional stacked chip technology is a cutting-edge technology in the current semiconductor field.
It improves the overall performance of semiconductors by effectively stacking multiple chips, solving the problem of performance improvement caused by the limitations of Moore's Law.
And as consumers' demand for smaller and faster devices continues to grow, three-dimensional stacked chip technology has become one of the important technologies to meet market demand.
It has significant advantages in improving chip performance and reducing power consumption.
It is also a chip that will be popular in the semiconductor industry in the future!
The three-dimensional stacked chip adopts a more compact circuit arrangement, which can accommodate more circuits in the same volume, thereby improving the performance of the chip.
This makes the device faster and more efficient when processing large amounts of data and complex tasks.
This technology makes the three-dimensional stacked chip far different from traditional chips and semiconductor products.
Compared with traditional semiconductor chips, three-dimensional stacked chips have unimaginable advantages in this regard.
After all, people are obsessed with the research and development of semiconductor products in order to greatly improve performance.
Obviously, in the eyes of semiconductor experts in any country except Longguo, the performance of three-dimensional stacked chips is far superior to any existing precision chips.
What's more, the advantages of three-dimensional stacked chips are far more than this.
The reason why it can be just a rumor can make the Eagle Sauce Country the leader of the future semiconductor industry in the eyes of senior officials of various countries.
It is precisely because the three-dimensional stacked chip almost surpasses traditional and existing chips of any precision in all aspects.
Because the three-dimensional stacked chip uses a more compact circuit design, the chip consumes less power when running.
This is especially important for mobile devices because they need to run for a long time and maintain low heat output.
And the three-dimensional stacked chip undoubtedly greatly reduces power consumption. In this regard, it can be said that the three-dimensional stacked chip has made a technological leap!
Moreover, the top leaders of various countries know that the emergence of 3D stacked chip technology will definitely bring new development opportunities to the semiconductor industry.
It can be applied not only to high-end fields such as personal computers and high-performance servers, but also to medical electronics, aerospace and other fields.
These fields have higher requirements for the performance and reliability of equipment, and 3D stacked chip technology can just meet these needs.
This means that in the future, or more precisely, after this international semiconductor competition, the United States will once again become the center of the world because of 3D stacked chips.
Because in the eyes of the top leaders of various countries, no semiconductor product can compare with 3D stacked chips.
Unless it is possible to develop a 2-nanometer precision chip that is impossible to develop now, it may be able to fight.
Otherwise, no chip can replace the existence of 3D stacked chips.
This is also the reason why almost all countries are in a hurry to build good relations with the United States when the rumors are not confirmed.
And because of the status and influence of 3D stacked chips, in the eyes of many top leaders of countries, it is already the champion of this international semiconductor competition.
After all, in terms of the impact, the difficulty of development, and the strong comprehensive performance, in the eyes of the top leaders other than Longguo, no product can compete with it.
Even when this rumor just came out, many semiconductor teams from various countries gave up.
Because originally in their cognition, the competition in this international semiconductor competition was far more intense than any previous international semiconductor competition.
Who knew that now someone has exposed the terrifying existence of three-dimensional stacked chips.
In their cognition, this is a product that cannot be developed with the theoretical knowledge currently mastered.
Even if this is a rumor, they believe that it is not groundless!
Because of this, no one knows what the entries of the national main teams that have not yet entered the competition are like.
Perhaps there are semiconductor products that are more terrifying than three-dimensional stacked chips!
How can they compare...
At this time in the Longdu compound.
The head of Longguo and a group of dragonsThe top leaders of the country are also discussing this matter.
But it is obvious that when they got this rumor, they were also shocked.
After all, this is a three-dimensional stacked chip.
It is a mountain that all countries' semiconductor industries cannot avoid.
Even Longguo, after getting this rumor, immediately summoned experts in the semiconductor industry to analyze this incident.
But according to the inference of these semiconductor industry experts, even with Longguo's existing semiconductor industry theoretical system, it is difficult to develop a complete three-dimensional stacked chip.
At this moment, this conclusion was like a basin of cold water poured on the heads of Longguo's top leaders who originally had great confidence in the championship of this international semiconductor competition because they had developed a two-nanometer precision chip.
Because according to what the experts in Longguo's semiconductor industry said.
Even if it is a complete finished three-dimensional stacked chip, even if it is a two-nanometer precision chip, even if it has the power to fight, it will be defeated because its influence is far less than that of a three-dimensional stacked chip.
After all, the judging process of the international semiconductor competition is a comprehensive process.
Although the two-nanometer precision chip is indeed excellent and has achieved a huge advantage in technology over traditional semiconductor products.
However, its influence, comprehensive performance and other comprehensive aspects are indeed not as good as a complete three-dimensional stacked chip.
When this conclusion was reached, it can be said that the top leaders of Longguo were in a panic.
After all, they prepared too much and paid too much for this international semiconductor competition.
The current change can be said to have caught all the top leaders of Longguo off guard.
But after all, they are the top leaders of Longguo and have seen big storms.
After just a moment of confusion, they stabilized their minds.
After all, at present.
The Eagle Sauce Country has not made any positive response to this rumor, so no one knows the authenticity of this rumor.
In this case, it is just a rumor after all!